Glass Interposer for High-Density Photonic Packaging
Lars Brusberg, Jason R. Grenier, Şükrü Ekin Kocabaş, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, Katerina Rousseva
Abstract
A circuit on glass with optical fiber interfaces, integrated planar waveguides, and through glass vias is demonstrated for co-packaged optics hosting and interconnecting electrical and photonic integrated circuits by flip-chip bonding.
Topics & Concepts
InterposerFlip chipPhotonic integrated circuitMaterials sciencePhotonicsOptoelectronicsPlanarOptical fiberIntegrated opticsElectronic packagingIntegrated circuit packagingIntegrated circuitElectronic circuitSilicon photonicsChipElectrical engineeringComputer scienceTelecommunicationsEngineeringNanotechnologyComposite materialAdhesiveComputer graphics (images)Layer (electronics)Etching (microfabrication)Semiconductor Lasers and Optical DevicesPhotonic and Optical DevicesNanofabrication and Lithography Techniques