Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder
Zhuangzhuang Hou, Xiuchen Zhao, Yue Gu, Chengwen Tan, Yongjun Huo, Hong Li, Sujun Shi, Ying Liu
Topics & Concepts
SolderingMaterials scienceIntermetallicWettingUltimate tensile strengthDopingCreepPhase (matter)MicrostructureDeformation (meteorology)Composite materialMetallurgyOptoelectronicsAlloyOrganic chemistryChemistryElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesMetallurgical and Alloy Processes