Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu
Ting-Chun Lin, Chien-Lung Liang, Shan-Bo Wang, Yung‐Sheng Lin, Chin-Li Kao, David Tarng, Kwang‐Lung Lin
Topics & Concepts
NanoindentationMaterials scienceAnnealing (glass)CopperDislocationSiliconThermalThermal stabilityComposite materialMetallurgyCrystallographyChemical engineeringChemistryPhysicsMeteorologyEngineeringAluminum Alloys Composites PropertiesMicrostructure and mechanical properties3D IC and TSV technologies