Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process
Yong-Min Lee, Kwan‐Woo Kim, Byung-Joo Kim
Abstract
In this study, the effects of polyimide (PI) content and postcuring on thermal and mechanical properties in PI and epoxy (EP) blending systems were investigated. EP/PI (EPI) blending reduced the crosslinking density and improved the flexural and impact strength due to ductility. On the other hand, in the postcuring of EPI, the thermal resistance improved due to the increased crosslinking density and the flexural strength increased by up to 57.89% due to the enhanced stiffness, but the impact strength decreased by up to 59.54%. EPI blending induced the improvement in the mechanical properties of EP, and the postcuring process of EPI was shown to be an effective method to improve heat resistance. It was confirmed that EPI blending induces improvement in the mechanical properties of EP, and the postcuring process of EPI is an effective method for improving heat resistance.