Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
Dongjin Kim, Byeongsoo Lee, Tae‐Ik Lee, Seungjun Noh, Chanyang Choe, Se Min Park, Minsu Kim
Topics & Concepts
Materials scienceTemperature cyclingMolding (decorative)Scanning electron microscopeMicrostructureComposite materialThermal resistancePower (physics)Junction temperatureFinite element methodPower densityThermalElectrical engineeringAutomotive engineeringStructural engineeringEngineeringMeteorologyQuantum mechanicsPhysicsElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor TechnologiesElectromagnetic Compatibility and Noise Suppression