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Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling

Myung Hyun Lee, Myung Jun Kim, Jae Jeong Kim

2021Electrochimica Acta36 citationsDOI

Topics & Concepts

BromideAdsorptionHalideElectrochemistryIonInorganic chemistryElectrolyteChemistryMaterials scienceChemical engineeringElectrodeOrganic chemistryPhysical chemistryEngineeringElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilityNanoporous metals and alloys
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