Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation
Gang Nan, Zhihui Xie, Xiaonan Guan, Xiangkun Ji, Daoguang Lin
Topics & Concepts
Constructal lawChipEnhanced Data Rates for GSM EvolutionStress (linguistics)Coupling (piping)ThermalAspect ratio (aeronautics)Materials scienceFlow (mathematics)Constant (computer programming)Mechanical engineeringElectronic engineeringMechanicsComputer scienceEngineeringElectrical engineeringOptoelectronicsComposite materialThermodynamicsHeat transferPhysicsProgramming languagePhilosophyTelecommunicationsLinguisticsHeat Transfer and Optimization3D IC and TSV technologiesElectronic Packaging and Soldering Technologies