Litcius/Paper detail

Effect of slurry and fixed abrasive pad on chemical mechanical polishing of SiC wafer

Lei He, Jun Li, Chao Tang, Hongyan Zhao, Daqing Zhou, Jiajia Si, Li Yang

2024Materials Science in Semiconductor Processing11 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationMaterials scienceAbrasivePolishingSlurryWaferComposite materialMetallurgyNanotechnologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research
Effect of slurry and fixed abrasive pad on chemical mechanical polishing of SiC wafer | Litcius