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Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

Anja Weidner, Horst Biermann

2021Advanced Engineering Materials48 citationsDOIOpen Access PDF

Abstract

Herein, a comprehensive review on the application of digital image correlation (DIC) for investigations of strain localization phenomena in the field of materials science and engineering (MSE) is provided. The Review is divided into three parts. In Part 1, the method of DIC is reviewed in terms of basic principles, correlation algorithms, and sources of errors. Part 2 is focused on the application of DIC in the field of MSE. This part is subdivided into the application of DIC in 1) combination with optical microscopy and 2) in combination with scanning electron microscopy (SEM). In Part 3, results of high‐resolution DIC obtained in combination with SEM are presented for high‐strength austenitic stainless steels—transformation‐induced plasticity steels and twinning‐induced plasticity steels—exhibiting microscopic strain localization phenomena. These investigations are supplemented by electron backscattered diffraction for interpretation of strain fields. Although DIC allows for both 2D and 3D calculations of displacement and strain fields, herein, 2D digital correlation is referred to only, as in particular with SEM only in‐plane displacements are calculated so far.

Topics & Concepts

Digital image correlationMaterials sciencePlasticityCrystal twinningScanning electron microscopeField emission gunStrain (injury)Solid mechanicsAustenitic stainless steelDiffractionTransformation (genetics)Composite materialOpticsMicrostructurePhysicsChemistryBiochemistryMedicineCorrosionGeneInternal medicineOptical measurement and interference techniquesAdvanced Surface Polishing TechniquesNon-Destructive Testing Techniques
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