Construction of silver-epoxy adhesive with suppressed silver migration rate based on thiol-silver interaction
Jianfang Guo, Chang Su, Jie Liu, Jue Cheng, Junying Zhang, Feng Gao
Topics & Concepts
EpoxyThiolAdhesiveMaterials scienceChemistryPolymer chemistryComposite materialOrganic chemistryLayer (electronics)Photopolymerization techniques and applicationsMaterial Properties and ApplicationsEpoxy Resin Curing Processes