A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
J. Vallepuga-Espinosa, I. Ubero-Martínez, Luis Rodríguez‐Tembleque, J. Cifuentes-Rodríguez
Topics & Concepts
MicroelectronicsHeat sinkThermal contact conductanceMaterials scienceContact resistanceThermal resistanceThermal contactThermal greaseElectronic packagingMechanical engineeringBall grid arrayComposite materialSolderingHeat transferThermal conductivityMechanicsEngineeringOptoelectronicsLayer (electronics)PhysicsAdhesion, Friction, and Surface InteractionsMechanical stress and fatigue analysisGear and Bearing Dynamics Analysis