Enhanced thermal conductivity and dielectric property of polyphenylene oxide/SiO2 composite by adding functional boron nitride strategy
Kang Luo, Hao Wang, Enzhu Li, Bin Tang, Ying Yuan
Abstract
Polymer composites with high thermal conductivity and excellent dielectric properties are ideal materials for high-speed electronic devices used in information processing. In this work, a high-speed microwave composite is designed by incorporating functional boron nitride (f-BN) into the polyphenylene oxide (PPO)/vinyl trimethoxysilane modified SiO 2 (V-SiO 2 ) composite. The dispersion of BN was significantly improved through surface coating followed by covalent modification . Adding f-BN into the PPO/V-SiO 2 composite significantly enhances its dielectric properties and thermal conductivity , resulting in a lower dielectric constant (3.06–3.24) and dielectric loss (2.2×10 −3 @10 GHz). An effective thermal conductivity path is established by an optimal interface combination of f-BN and the PPO/V-SiO 2 composite at a f-BN content of 15 wt%, the thermal conductivity of the composite reaches 0.858 W/(m·K). Moreover, the composite exhibits high thermal stability, low moisture absorption (<0.36 %), and possesses lightweight and flame retardant characteristics. This research provides a novel approach for PPO-based composites in high-speed devices and demonstrates the promising potential for applications in high-frequency substrates.