Multi-physical field coupling effect in micro pin-fin channel cooling with coaxial-like through-silicon via (TSV) for three-dimensional integrated chip (3D-IC)
Shiqi Xu, Yuanle Zhang, Qiang Li, Xuemei Chen
Topics & Concepts
Materials scienceThrough-silicon viaCoaxialCoupling (piping)ChipSiliconThree-dimensional integrated circuitFinThermal management of electronic devices and systemsChannel (broadcasting)Silicon chipOptoelectronicsMechanical engineeringElectronic engineeringElectrical engineeringIntegrated circuitEngineeringComposite material3D IC and TSV technologiesAdvancements in Semiconductor Devices and Circuit DesignSemiconductor materials and devices