In-situ revealing the degradation mechanisms of Pt film over 1000 °C
Dongfeng Ma, Shengcheng Mao, Jiao Teng, Xinliang Wang, Xiaochen Li, Jin Ning, Zhipeng Li, Qing Zhang, Zhiyong Tian, Menglong Wang, Ze Zhang, Xiaodong Han
Topics & Concepts
Materials scienceNucleationGrain boundaryVoid (composites)Composite materialUltimate tensile strengthNanoscopic scaleDegradation (telecommunications)In situGrain sizeNanotechnologyMicrostructureElectronic engineeringChemistryOrganic chemistryEngineeringSemiconductor materials and devicesCopper Interconnects and ReliabilitySemiconductor materials and interfaces