Litcius/Paper detail

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling

Weiran Yang, Yulong Ding, Mingqing Liao, Fengjiang Wang

2022Journal of Materials Science Materials in Electronics10 citationsDOI

Topics & Concepts

SolderingTemperature cyclingMaterials scienceIntermetallicIsothermal processShear strength (soil)Composite materialMetallurgyThermalThermodynamicsAlloyPhysicsSoil waterEnvironmental scienceSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties
Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling | Litcius