Constructing a Novel Moderately Modulus “Rigid-Flexible” Structure with Synergistic Reinforcement on the Carbon Fiber Surface to Enhance the Mechanical Properties of Carbon Fiber/Epoxy Composites at Elevated Temperatures
Peifeng Feng, Lichun Ma, Mingguang Zhang, Yiling Quan, Mingzhuan Li, Xin Zhou, Xingyao Liu, Xigao Jian, Jian Xu
Abstract
To improve the mechanical performance of carbon fiber (CF)/epoxy composites in high-temperature environments, a moderately modulus gradient modulus interlayer was constructed at the interface phase region of composites. This involved the design of a “rigid-flexible” synergistic reinforcement structure, incorporating rigid nanoparticle GO@CNTs and a flexible polymer polynaphthyl ether nitrile ketone onto the CF surface. Notably, at 180 °C, compared to commercial CF composites, the CF-GO@CNTs-PPENK composites displayed a remarkable improvement in their mechanical characteristics (interfacial shear, interlaminar shear, flexural strength, and modulus), achieving enhancements of 173.0, 91.5, 225.7, and 376.4%, respectively. The principal reason for this the moderately modulus interface phase composed of GO@CNTs-PPENK (where GO and CNTs predominantly consist of carbon atoms with sp 2 -hybridized orbitals, forming highly stable C–C structures, while PPENK possesses a “twisted non-coplanar” structure), which exhibited resistance to deformation at high temperatures. Moreover, it greatly improved the mechanical interlocking, wettability, and chemical compatibility between CF and the epoxy. It also played a crucial role in balancing and buffering the modulus disparity. The interface failure behavior and reinforcement mechanisms of the CF composites were analyzed. Furthermore, validation of the presence of a moderately modulus gradient interlayer at the interface phase region of CF-GO@CNTs-PPENK composites was performed by using atomic force microscopy. This study has established a theoretical foundation for the development of high-performance CF composites for use in high-temperature fields.