The effect of Re addition on the thermal stability and structure of Ni–P electroless coatings
Joanna Wojewoda-Budka, Anna Wierzbicka-Miernik, M.J. Szczerba, Honorata Kazimierczak, Izabella Kwiecień, J. Morgiel, Katarzyna Stan-Głowińska, Fabrizio Valenza
Topics & Concepts
Materials scienceCrystallizationThermal stabilityAmorphous solidDeposition (geology)Temperature cyclingNickelChemical engineeringPhase (matter)MetallurgyComposite materialThermalCrystallographyPhysicsEngineeringMeteorologyBiologyPaleontologyOrganic chemistrySedimentChemistryElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfaces