The study of curing behavior and thermo-mechanical properties of epoxy adhesives with different anhydrides
Sheng Qi, Qionghai Chen, Weiwen Gu, Ruicheng Wang, Xiaoyu Gu, Jun Liu, Tongbing Sun, Yu Chen, Jun Sun, Sheng Zhang, Jun Sun, Sheng Zhang
Topics & Concepts
EpoxyAdhesiveCuring (chemistry)Composite materialMaterials scienceLayer (electronics)Epoxy Resin Curing ProcessesPhotopolymerization techniques and applicationsSynthesis and properties of polymers