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Altering the CO<sub>2</sub> Electroreduction Pathways Towards C<sub>1</sub> or C<sub>2+</sub> Products via Engineering the Strength of Interfacial Cu−O Bond

Yu Zhang, Yicheng Li, Nana Gao, Ernest Pahuyo Delmo, Guoyu Hou, A-Li Luo, Dongyang Wang, Ke Chen, Markus Antonietti, Tianxi Liu, Zhihong Tian

2024Angewandte Chemie International Edition36 citationsDOIOpen Access PDF

Abstract

Abstract Copper (Cu)‐based catalysts have established their unique capability for yielding wide value‐added products from CO 2 . Herein, we demonstrate that the pathways of the electrocatalytic CO 2 reduction reaction (CO 2 RR) can be rationally altered toward C 1 or C 2+ products by simply optimizing the coordination of Cu with O‐containing organic species (squaric acid (H 2 C 4 O 4 ) and cyclohexanehexaone (C 6 O 6 )). It is revealed that the strength of Cu−O bonds can significantly affect the morphologies and electronic structures of derived Cu catalysts, resulting in the distinct behaviors during CO 2 RR. Specifically, the C 6 O 6 −Cu catalysts made up from organized nanodomains shows a dominant C 1 pathway with a total Faradaic efficiency (FE) of 63.7 % at −0.6 V (versus reversible hydrogen electrode, RHE). In comparison, the C 4 O 4 −Cu with an about perfect crystalline structure results in uniformly dispersed Cu‐atoms, showing a notable FE of 65.8 % for C 2+ products with enhanced capability of C−C coupling. The latter system also shows stable operation over at least 10 h with a high current density of 205.1 mA cm −2 at −1.0 V RHE , i.e., is already at the boarder of practical relevance. This study sheds light on the rational design of Cu‐based catalysts for directing the CO 2 RR reaction pathway.

Topics & Concepts

CopperCatalysisBond strengthMaterials scienceValue (mathematics)Chemical engineeringMetallurgyNanotechnologyChemistryComputer scienceOrganic chemistryEngineeringAdhesiveLayer (electronics)Machine learningCO2 Reduction Techniques and CatalystsIonic liquids properties and applicationsCatalysis and Oxidation Reactions
Altering the CO<sub>2</sub> Electroreduction Pathways Towards C<sub>1</sub> or C<sub>2+</sub> Products via Engineering the Strength of Interfacial Cu−O Bond | Litcius