In-depth analysis of sintering, exposure time, and layer height (um) in LRS 3D printed devices with DLP
Shenggui Chen, Sadaf Bashir Khan, Nan Li, Chuang Xiao
Topics & Concepts
Materials scienceSinteringLayer (electronics)Composite materialDigital Light ProcessingOptoelectronicsNanotechnologyOpticsProjectorPhysicsAdditive Manufacturing and 3D Printing Technologies3D IC and TSV technologiesElectronic Packaging and Soldering Technologies