Litcius/Paper detail

Quantifying adhesive thickness and adhesion parameters using higher-order SH guided waves

Dileep Koodalil, Prabhu Rajagopal, Krishnan Balasubramaniam

2021Ultrasonics34 citationsDOI

Topics & Concepts

Materials scienceEpoxyAdhesiveComposite materialShear modulusShear (geology)StiffnessDispersion (optics)AluminiumOpticsPhysicsLayer (electronics)Ultrasonics and Acoustic Wave PropagationNon-Destructive Testing TechniquesStructural Health Monitoring Techniques
Quantifying adhesive thickness and adhesion parameters using higher-order SH guided waves | Litcius