Reliability analysis of multi-component systems subjected to dependent degradation processes and random shocks in dynamic environments
Qingzhu Liang, Songlin Liu, Changhong Peng
Topics & Concepts
Reliability (semiconductor)Degradation (telecommunications)Component (thermodynamics)Reliability engineeringComputer scienceEngineeringEnvironmental sciencePhysicsThermodynamicsTelecommunicationsPower (physics)Reliability and Maintenance OptimizationFatigue and fracture mechanicsRisk and Safety Analysis