Atomic layer deposited Mo2N thin films using Mo(CO)6 and NH3 plasma as a Cu diffusion barrier
Yonghwan Joo, Dip K. Nandi, Rahul Ramesh, Yujin Jang, Jong‐Seong Bae, Taehoon Cheon, Soo‐Hyun Kim
Topics & Concepts
Materials scienceDiffusion barrierThin filmAnnealing (glass)Atomic layer depositionMolybdenumAnalytical Chemistry (journal)Electrical resistivity and conductivityNitrideCrystalliteLayer (electronics)MetallurgyComposite materialNanotechnologyChemistryChromatographyEngineeringElectrical engineeringSemiconductor materials and devicesMetal and Thin Film MechanicsCopper Interconnects and Reliability