Interfacial structure and formation mechanism of tungsten/steel HIP diffusion bonding joints using Ni interlayer
Yue Wang, Shuai Chen, Xuanwei Lei, Jian Yang, Jihua Huang, Shuhai Chen, Zheng Ye, Yüe Zhao
Topics & Concepts
Materials scienceLayer (electronics)TungstenComposite materialJoint (building)BrittlenessDiffusionDiffusion bondingSubstrate (aquarium)Diffusion layerSurface finishMetallurgyStructural engineeringPhysicsEngineeringOceanographyGeologyThermodynamicsAdvanced materials and compositesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties