Exploring the role of indium on the microstructure evolution and interface bonding behavior of brazing diamond abrasive with modified Cu–Sn–Ti
Bing Cui, Zhengwei Liu, Quanbin Du, Hailiang Deng, Li Yang
Topics & Concepts
BrazingMaterials scienceMicrostructureFiller metalWettingDiamondComposite materialAbrasiveMetallurgyFiller (materials)Diamond toolIndiumAlloyWeldingDiamond turningArc weldingAdvanced machining processes and optimizationAdvanced materials and compositesTunneling and Rock Mechanics