Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding
Kyung Deuk Min, Choong-Jae Lee, Byeong-Uk Hwang, Jae-Ha Kim, Jun-Ho Jang, Seung‐Boo Jung
Topics & Concepts
IntermetallicMaterials scienceSolderingSinteringNickelTernary operationCopperPhase (matter)MetallurgyJoint (building)Composite materialAlloyChemistryComputer scienceProgramming languageEngineeringArchitectural engineeringOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis