Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level
Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian, Kemal Aygün
Abstract
Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for developing an open chiplet ecosystem, where chiplets from any supplier can be packaged anywhere in an interoperable manner. This article delves into the architectural, circuit, channel, and packaging aspects that we developed that has been adopted in the UCIe 1.0 Specification. We present our results based on our channel and circuit implementation studies.
Topics & Concepts
InteroperabilityInterconnectionComputer scienceEmbedded systemOpen sourceOpen platformChannel (broadcasting)Open standardTelecommunicationsOperating systemSoftware3D IC and TSV technologiesInterconnection Networks and SystemsLow-power high-performance VLSI design