Mechanical strength problem of thin silicon wafers (120 and 140 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si1.svg"> <mml:mrow> <mml:mi mathvariant="normal">μ</mml:mi> <mml:mi mathvariant="normal">m</mml:mi> </mml:mrow> </mml:math> ) cut with thinner diamond wires (Si kerf 120 → 100 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si1.svg"> <mml:mrow> <mml:mi mathvariant="normal">μ</mml:mi> <mml:mi mathvariant="normal">m</mml:mi> </mml:mrow> </mml:math> ) for photovoltaic use

Halubai Sekhar, Tetsuo Fukuda, Katsuto Tanahashi, Hidetaka Takato, Hiromichi Ono, Yoshiyuki Sampei, Tsubasa Kobayashi