Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles
Zhe Cui, Qiang Jia, Yishu Wang, Dan Li, Chien-Ping Wang, Hongqiang Zhang, Ziyi Lu, Limin Ma, Guisheng Zou, Fu Guo
Topics & Concepts
SinteringMaterials scienceFormic acidShear strength (soil)MicrostructureNanoparticleFormateCopperChemical engineeringAtomic diffusionDiffusionOverlayerMetallurgyComposite materialCatalysisNanotechnologyOrganic chemistryPhysical chemistryCrystallographyEnvironmental scienceChemistrySoil waterSoil scienceEngineeringPhysicsThermodynamicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced materials and composites