Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution
Qihai Li, Wei Zhao, Wei Zhang, Weiwei Chen, Zhi‐Quan Liu
Topics & Concepts
Ball grid arrayMaterials scienceIntermetallicSolderingMicrostructureTemperature cyclingPrinted circuit boardComposite materialMetallurgyGrain boundaryThermalAlloyOperating systemPhysicsMeteorologyComputer scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis