Improving the interfacial bonding of CNT/Cu composites using CPD bridges
Liangqi Zhang, Rui Bao, Jianhong Yi, Jingmei Tao, Shengda Guo, Songlin Tan
Topics & Concepts
Materials scienceComposite materialCopperComposite numberUltimate tensile strengthCarbon nanotubeDuctility (Earth science)Electrical resistivity and conductivityMetallurgyElectrical engineeringCreepEngineeringAluminum Alloys Composites PropertiesElectromagnetic wave absorption materialsGraphene research and applications