Effect of electrodeposited Cu interlayer thickness on characterizations and adhesion force of Ni/Cu/Ni coatings on polyetherimide composite substrates
Dingkai Xie, Wangping Wu, Jia‐Qi Huang, Xiang Wang, Yi Zhang, Zhizhi Wang, Peng Jiang, Lixin Tang, Fulong Wu, Qinqin Wang, Fulong Wu, Qinqin Wang
Topics & Concepts
Materials sciencePolyetherimideComposite numberComposite materialCopperCoatingScanning electron microscopeAmorphous solidNickelSubstrate (aquarium)MetallurgyPolymerCrystallographyChemistryOceanographyGeologyElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCorrosion Behavior and Inhibition