In-operando visualization of the dynamic microvia copper filling process for metal interconnection of integrated circuit
Jiaqiang Yang, Tao Song, Zhao‐Yun Wang, Lei Jin, Yi Zhao, Ren Hu, Jian‐Jia Su, Fang‐Zu Yang, Dongping Zhan, Lianhuan Han
Topics & Concepts
InterconnectionCopperMaterials sciencePrinted circuit boardProcess (computing)Copper interconnectMetalVisualizationNanotechnologyMetallurgyEngineeringElectrical engineeringComputer scienceMechanical engineeringTelecommunicationsOperating systemElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilityElectronic Packaging and Soldering Technologies