“Heat‐Press‐N‐Go” Stretchable Interconnects Enabled by Liquid Metal Conductor with Supramolecular Confinement
Liqing Ai, Weikang Lin, Limei Ai, Yannan Li, Mengyi Qiang, Xiaoya Wang, Min Shi, Zhengbao Yang, Xi Yao
Abstract
Abstract The integration of soft, conformable components and rigid microelectronics or devices is a critical frontier in stretchable hybrid device development. However, engineering interconnects capable of tolerating high‐stress concentrations and preventing debonding failures remain a key challenge. Here a stretchable conductive interconnect derived from the liquid metal conductor with supramolecular confinement is reported, capable of reliably connecting soft and rigid parts through a simple “Heat‐Press‐N‐Go” method. Leveraging the dynamic bonding nature of supramolecular polymers, when confined within liquid metal compartments, not only effectively stabilizes the conductive path of the stretchable interconnect, but also offers high adhesion to diverse surfaces, reaching an exceptional electrical stretchability of up to 2800%. As proof of concept, this interconnect is used to assemble wearable devices including reconfigurable stretchable circuits, multifunctional sensors, and on‐skin electromyography, exhibiting high signal integrity and mechanical durability. The “Heat‐Press‐N‐Go” chip and circuit integration offers the boundless potential to enhance the adaptability, convenience, and versatility of on‐skin and wearable electronics across various applications.