Litcius/Paper detail

Process and geometrical integrity optimization of electron beam melting for copper

Sasan Dadbakhsh, Xiaoyu Zhao, Prithiv Kumar Chinnappan, Vishal Shanmugam, Zeyu Lin, Christopher Hulme-Smith

2022CIRP Annals15 citationsDOIOpen Access PDF

Abstract

This work systematically analyzes and optimizes the process of electron beam melting for pure copper. It is shown that, for reliable manufacturing, the preheating temperature should be optimized to avoid porosity as well as part deformation. The electron beam should be fully focused to prevent shrinkage voids (correlated to negative defocusing) and material spattering (linked to positive defocusing). Smoother surfaces from lower hatch spacing (e.g., 100µm) can improve the density reliability, while longer overhangs are reached by a higher hatch spacing. A suitable starting contour strategy is also applied to mitigate border porosities, reduce side roughness and increase geometric precision.

Topics & Concepts

ShrinkageMaterials sciencePorosityCopperCathode rayReliability (semiconductor)Beam (structure)Surface finishWork (physics)Surface roughnessDeformation (meteorology)Process (computing)Composite materialElectronMechanical engineeringMetallurgyStructural engineeringComputer scienceEngineeringPhysicsThermodynamicsQuantum mechanicsOperating systemPower (physics)Additive Manufacturing Materials and ProcessesAdditive Manufacturing and 3D Printing TechnologiesWelding Techniques and Residual Stresses