3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste
Chuantong Chen, Yue Gao, Zhi‐Quan Liu, Katsuaki Suganuma
Topics & Concepts
Materials sciencePyramid (geometry)Plating (geology)SinteringLayer (electronics)Composite materialSubstrate (aquarium)Gold plating (software engineering)MetallurgyConnection (principal bundle)Structural engineeringGeometryEconomicsGeophysicsEngineeringGeologyOceanographyMathematicsManagementElectronic Packaging and Soldering Technologies3D IC and TSV technologies