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Thermally-Aware Layout Design of <i>β</i>-Ga₂O₃ Lateral MOSFETs

Samuel Kim, Daniel Shoemaker, Bikramjit Chatterjee, Andrew J. Green, Kelson D. Chabak, Eric R. Heller, Kyle J. Liddy, Gregg H. Jessen, Samuel Graham, Sukwon Choi

2022IEEE Transactions on Electron Devices28 citationsDOI

Abstract

<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\beta $ </tex-math></inline-formula> -phase gallium oxide ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\beta $ </tex-math></inline-formula> -Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) is drawing significant attention in the power electronics field due to its remarkable critical electric field strength [greater than gallium nitride (GaN) and silicon carbide (SiC)] and the availability of high-quality melt-grown substrates providing the opportunity for low-cost manufacturing. However, because of the low thermal conductivity of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\beta $ </tex-math></inline-formula> -Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> , thermal management strategies at the device-level are required to achieve the targeted high-power capabilities. In this work, the effects of the anisotropic thermal conductivity of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\beta $ </tex-math></inline-formula> -Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> and the geometrical design of the metal electrodes/interconnects on the device self-heating were investigated. For a power density ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${P}_{\text {dis}}$ </tex-math></inline-formula> ) of 1 W/mm at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {GS}} =$ </tex-math></inline-formula> 4 V (i.e., a fully open channel condition), when the channel width is along a direction perpendicular to ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\bar {{2}}{01}$ </tex-math></inline-formula> ), the channel temperature decreases by 10% as compared to a case aligning the channel length along the direction close to [100]. Also, by decreasing the width of the interconnect between the drain electrode and the metal bond pad (serving as a heat pathway) from 100 to <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$10~\mu \text{m}$ </tex-math></inline-formula> (90% reduction), the channel temperature increased by ~8% for <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${P}_{\text {dis}} =$ </tex-math></inline-formula> 1 W/mm. Last, for devices with identical heat generation profiles, increasing the distance between the gate and drain contact from 1 to 10 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> , results in a 35% increase in the channel temperature rise. This work highlights the importance of thermally aware device layout design for lateral <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\beta $ </tex-math></inline-formula> -Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> transistors, in terms of maximizing both the electrical and thermal performance.

Topics & Concepts

AlgorithmMathematicsComputer scienceGa2O3 and related materialsZnO doping and propertiesElectronic and Structural Properties of Oxides
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