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Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints

Dong-Hwan Lee, Min-Seong Jeong, Jeong‐Won Yoon

2022Journal of Materials Science Materials in Electronics26 citationsDOI

Topics & Concepts

SolderingMaterials scienceDip solderingReflow solderingMetallurgyComposite materialIntermetallicShear strength (soil)Wave solderingMicrostructureScanning electron microscopeLayer (electronics)AlloyEnvironmental scienceSoil waterSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints | Litcius