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CFET Design Options, Challenges, and Opportunities for 3D Integration

Lars W. Liebmann, Jeffrey Smith, D. Chanemougame, Paul Gutwin

20212021 IEEE International Electron Devices Meeting (IEDM)31 citationsDOI

Abstract

Design details of standard cell architectures using complementary field effect transistors (CFET) are explored. The primary structural elements of CFET are reviewed and the layout impact of several 2 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">nd</sup> -order technology constructs is analyzed. A manufacturability assessment and cost analysis of the resulting CFET technology-architecture definition is presented. Finally, the extendibility of CFET to 3.5-track cell height as well as higher-order 3D integration is explored.

Topics & Concepts

Design for manufacturabilityComputer scienceIntegrated circuit designOrder (exchange)Field (mathematics)Software engineeringSystems engineeringComputer architectureEngineeringEmbedded systemMathematicsElectrical engineeringPure mathematicsFinanceEconomics3D IC and TSV technologiesAdvancements in Semiconductor Devices and Circuit DesignSemiconductor materials and devices
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