Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions
Qianqian Song, Wenchao Yang, Yitai Li, Jun Mao, Weiou Qin, Yongzhong Zhan
Topics & Concepts
SolderingMaterials scienceIsothermal processMicrostructureIntermetallicUltimate tensile strengthFracture (geology)Composite materialComposite numberWettingBrittlenessJoint (building)AlloyStructural engineeringThermodynamicsPhysicsEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties