Litcius/Paper detail

Deep ensemble learning for material removal rate prediction in chemical mechanical planarization with pad surface topography

Jongmin Jeong, Yeongil Shin, Seunghun Jeong, Seonho Jeong, Haedo Jeong

2024Precision Engineering13 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationSurface (topology)Materials scienceEnsemble learningComputer scienceArtificial intelligenceComposite materialPolishingGeometryMathematicsAdvanced Surface Polishing TechniquesSurface Roughness and Optical MeasurementsAdvanced machining processes and optimization
Deep ensemble learning for material removal rate prediction in chemical mechanical planarization with pad surface topography | Litcius