Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silicon wafer
Ning Huang, Ping Zhou, Saurav Goel
Topics & Concepts
Materials scienceMonocrystalline siliconNanoindentationIndentationWaferSiliconMachiningDislocationComposite materialSilicon carbideSingle crystalBurgers vectorAnisotropyStress (linguistics)IsotropyNanomanufacturingGrindingCrystallographyOpticsMetallurgyNanotechnologyPhilosophyPhysicsChemistryLinguisticsAdvanced Surface Polishing TechniquesMetal and Thin Film MechanicsIntegrated Circuits and Semiconductor Failure Analysis