Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips
Wei He, Zixuan Wang, Jiaqi Li, Qiang Li
Topics & Concepts
Materials scienceFinCoolantHeat transferCoupling (piping)Through-silicon viaThree-dimensional integrated circuitEnhanced heat transferSiliconThermalComposite materialIntegrated circuitOptoelectronicsMechanical engineeringMechanicsThermodynamicsEngineeringPhysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesThermal properties of materials