Effects of boron nitride and carbon nanotube on damping properties, thermal conductivity and compression stress relaxation behavior of <scp>BIIR</scp>
Huanhuan Dong, Guojie Zhang, Yang Jiang, Yong Zhang
Abstract
Abstract As highly integrated electronic components and devices are used under high electrical power and mechanical vibration, the thermal conductivity, damping properties, and compression stress relaxation of protection materials have become critical factors which affect the long‐term durability and reliability of the materials. Damping rubbers are widely used, but their thermal conductivity and compression stress relaxation are rarely studied. Herein, the effects of boron nitride (BN) and carbon nanotube on the damping properties, thermal conductivity, and compression stress relaxation behavior of brominated butyl rubber (BIIR) are investigated. BN increases the damping factor of BIIR and widens its effective damping temperature range. The maximum damping factor of BIIR composite with 12.3 wt% BN is 0.95, and the effective damping temperature range is −41 to 60°C. Moreover, the thermal conductivity of BIIR with 12.3 wt% BN is 0.46, much higher than that of BIIR. With increasing BN content, the thermal conductivity of BIIR/BN composites increases gradually, while their stress relaxation rate decreases. Carbon nanotube can further increase the thermal conductivity of BIIR/BN composites. BIIR/BN composites with high damping properties and thermal conductivity have a great application potential in the heat dissipation and vibration reduction of electronic devices.