Impact of Granularity on the Oxidation Kinetics of Copper
Björn Maack, Niklas Nilius
Abstract
Polycrystalline copper films with mean grain sizes varying by three orders of magnitude are prepared to correlate morphology and oxidation kinetics of metals. The films are oxidized to cuprous oxide at well‐defined pressure and temperature conditions, monitoring the progress of the reaction by in situ optical transmission spectroscopy. The oxidation kinetics is retrieved by fitting the optical data to a three‐layer Cu 2 O/Cu 2 O–Cu/Cu model with the central layer accounting for the inhomogeneity of the oxidation front due to grain boundaries. The analysis reveals the highest oxidation rates for Cu films with finest granularity, demonstrating the decisive role of grain boundaries for Cu mass transport during oxidation. Moreover, reaction rates are found to differ by one order of magnitude for oxidation along the grain boundaries and into the crystalline Cu grains. In fact, slow oxidation into the Cu crystallites is responsible for an incomplete metal‐oxide conversion in the case of coarse‐granular films. The experiments demonstrate the direct interplay between morphology and oxidation kinetics for metals.