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Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Hailong Xu, Zhen Yin, Qing Miao, Chenwei Dai, Jingcai Cheng, Hua Li, Zhiqiang Liang, Zhanjie Li

2023Materials Science in Semiconductor Processing13 citationsDOI

Topics & Concepts

Materials scienceSapphireGrindingSurface roughnessSurface integrityGrindComposite materialFlatness (cosmology)BrittlenessOpticsLaserPhysicsCosmologyQuantum mechanicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques
Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness | Litcius