Novel PVA-modified CeO2 abrasives: Achieving dual control of SiO2 and Si3N4 removal rates in STI-CMP
Ning Xu, Jiaguo Yu, Yu Lin, Kailong Gao, Ziheng Gao, Yansong Wang, Guosheng Zhang, Zhuo Wang
Topics & Concepts
Materials scienceDual (grammatical number)Chemical engineeringEngineeringArtLiteratureAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced materials and composites