The physical improvement of copper deposition uniformity with the simulation models
Chun-Wei Ma, Shun-Hsuan Yu, Jen-Kuang Fang, Ping‐Feng Yang, Hou-Chien Chang
Topics & Concepts
WaferOverpotentialMultiphysicsCathodeAnodeElectroplatingDeposition (geology)Current (fluid)ChemistryCopperCurrent densityElectrolyteElectrodeFinite element methodLayer (electronics)Composite materialOptoelectronicsMaterials scienceThermodynamicsElectrochemistryPhysicsPhysical chemistryPaleontologyBiologySedimentQuantum mechanicsOrganic chemistryElectrodeposition and Electroless CoatingsCopper Interconnects and ReliabilitySemiconductor materials and interfaces