Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration
Hyunsik Jeong, Kwang‐Won Seo, Jinsoo Bae, Gunhee Jang
Topics & Concepts
Ball grid arraySolderingRandom vibrationFinite element methodVibrationPrinted circuit boardMaterials scienceSineStructural engineeringVibration fatigueSurface-mount technologyNatural frequencyComposite materialEngineeringAcousticsMathematicsElectrical engineeringGeometryPhysicsElectronic Packaging and Soldering TechnologiesMetal Forming Simulation Techniques3D IC and TSV technologies