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Origin and evolution of a crack in silicon induced by a single grain grinding

Zhenyu Zhang, Xin Wang, Fanning Meng, Dongdong Liu, Siling Huang, Junfeng Cui, Jianmei Wang, Wei Wen

2022Journal of Manufacturing Processes71 citationsDOI

Topics & Concepts

Materials scienceBrittlenessMicroscale chemistryComposite materialFracture mechanicsFracture toughnessCatastrophic failureFracture (geology)GrindingForensic engineeringMathematicsEngineeringMathematics educationAdvanced Surface Polishing TechniquesForce Microscopy Techniques and ApplicationsDiamond and Carbon-based Materials Research
Origin and evolution of a crack in silicon induced by a single grain grinding | Litcius